Launch Date: February 26, 2025

Manufacturing Process: 4nm (TSMC)

CPU Architecture: Octa-core (4+4)

4x Arm Cortex-A78 @ 2.6 GHz

4x Arm Cortex-A55 @ 2.0 GHz

GPU: Arm Mali-G615 MC2

Architecture: Valhall-based

Features: OpenGL ES 3.2, Vulkan 1.3, OpenCL 2.0

AI Processor: MediaTek NPU 6.0

Features: Advanced AI camera enhancements, low-power edge AI processing

Memory Support:

Type: LPDDR5 / LPDDR4x

Max Frequency: Up to 6400 Mbps

Storage Support: UFS 2.2

Connectivity:

Cellular: 5G R16 modem, 3CC-CA support

Wi-Fi: Tri-band Wi-Fi 6E

Bluetooth: 5.x

Multimedia:

Camera Support: Up to 200MP

Video Recording: 4K @ 30fps HDR

Display Support: Dual display support for foldables and flip phones

HDR Support: Google Ultra HDR

Gaming Features:

MediaTek HyperEngine Gaming Technology 3.0

Enhanced thermal and power efficiency

14%–36% lower power use in gaming workloads vs previous generations

AI Enhancements:

15% AI performance boost over Dimensity 7300

Real-time scene recognition and optimization

Performance Scores (AnTuTu v10):

Total Score: 777,255

CPU: 227,672

GPU: 176,970

Memory: 192,685

UX: 179,928

The MediaTek Dimensity 7400X is a mid-range powerhouse built to deliver premium features like dual-display support, strong AI capabilities, and next-gen gaming performance—ideal for stylish flip and foldable smartphones.