CPU Configuration
The Dimensity 8500 is said to use an octa-core design — but instead of the usual mix of performance and efficiency cores, it goes all-in with eight Cortex-A725 cores for maximum performance.
Process Node: TSMC 4nm (second-generation 4nm process)
Architecture: ARMv9-based with all Cortex-A725 cores
Core Setup: 8-core (octa-core) high-performance layout
Prime Core: 1× Cortex-A725 @ up to 3.4GHz
Remaining Cores: 7× Cortex-A725 @ 2.85–3.0GHz (expected based on tuning)
This all-big-core design mirrors the approach seen in the Dimensity 8400 but with notable clock speed increases that could deliver stronger single-thread and multi-thread performance.
Upgraded GPU & Performance
On the graphics side, the Dimensity 8500 reportedly uses an ARM Mali-G720 GPU running at around 1.5GHz, an improvement over the previous generation’s 1.3GHz setup. This boost could translate into smoother gaming performance and better graphics rendering.
Early performance benchmarks reportedly show an AnTuTu score of around 2.2 million points, suggesting that this chip could rival Qualcomm’s Snapdragon 8s Gen 3 in some tasks.
Connectivity and Efficiency
Like its predecessors, the Dimensity 8500 integrates a 5G modem with Sub-6GHz support, dual 5G standby, and Wi-Fi 7 capability. Combined with TSMC’s efficient 4nm manufacturing, the chip should maintain impressive performance without sacrificing power efficiency or thermal stability.
AI and Imaging
While detailed information about the AI and imaging engines remains limited, expectations point toward MediaTek’s 7th-gen APU and an Imagiq 990 ISP (or higher). These components could support up to 320MP sensors, 4K HDR recording, and advanced AI-based image enhancement features.
Expected Specifications Summary
Category Details
Process TSMC 4nm (2nd Gen)
CPU 8x Cortex-A725 cores
Prime Core 1x @ 3.4GHz
Other Cores 7x @ 2.85–3.0GHz
GPU Mali-G720 (1.5GHz)
AI Engine 7th-gen APU
ISP Imagiq 990 (up to 320MP support)
Connectivity 5G (Sub-6GHz), Wi-Fi 7, Bluetooth 5.4
Memory/Storage LPDDR5X RAM, UFS 4.0
AnTuTu Score (leaked) ~2.2 million
Conclusion
The MediaTek Dimensity 8500 looks like a major step forward for midrange and affordable flagship smartphones. With its all-big-core architecture, higher GPU clocks, and next-gen fabrication process, it’s clear that MediaTek aims to narrow the gap with Qualcomm’s premium lineup.
While official details and real-world benchmarks are yet to be confirmed, the Dimensity 8500 might just become one of the most balanced and efficient chips of 2025.
Source: Digital Chat Station (Weibo leak)
Image Credit: ImpliedTech Originals